WORKSHOP ON ANALOG INTEGRATED CIRCUIT DESIGN

date : 10-13 November 2013

Course Overview

This is an introductory level 4-day workshop designed for students and engineers who are interested in learning about Analog Integrated Circuit (AIC) Design. The fundamental building blocks used in analog circuit are covered and simulated using Electronic Design Automation (EDA) tools.
Who should attend?
This workshop assumes basic understanding of semiconductor devices and electronic circuits. Thus students doing graduation project or post-graduate work in Analog IC Design should attend this course. Moreover a designer who wishes to learn about basics in Analog/Mixed-signal IC Design should attend this course.
Training Content
1.1. Introduction to WaferCat’s Muli-Project Wafer (MPW) fabrication services.
1.2. Review of transistor operation
-MOS I/V characteristics (e.g. threshold voltage and derivation of I/V characteristics).
-Transistor second order effects (e.g. body effect, channel length modulation and short channel effects).
-Small signal model (e.g. transconductance, body effect transconductance, drain-source impedance).
-High frequency model (e.g. parasitic components will be added to the small signal model).
1.3. Single stage amplifiers
-Common topologies.
-Biasing.
-Understanding fundamental small signal parameters (e.g. Gm, gain and output resistance).
-Understanding fundamental large signal parameters (e.g. Input common mode range and Dynamic range).
-Frequency response and noise characteristics.
1.4. Current Mirrors and Voltage Reference
Basic concept of current mirrors.
-Widely used configurations of current mirrors.
-Basics of voltage reference.
-Bandgap voltage reference and its implementation.
1.5. Differential amplifier
-Lecture classes
-Single-ended and differential operation.
-Basic differential pair: qualitative analysis, quantitative analysis.
-Common-mode response (e.g. CM noise, CMRR and PSRR).
-Differential pair with MOS loads: differential pair with diode connected and current source loads.
-Layout issues (e.g. Matching and substrate noise shielding) and recommendations.